Nanoscale-Precision Removal of Copper in Integrated Circuits Based on a Hybrid Process of Plasma Oxidation and Femtosecond Laser Ablation

Copper (Cu) is the main interconnect conductor for integrated circuits (IC), and its processing quality is very important to device performance. Herein, a hybrid process of plasma oxidation and femtosecond laser (fs-laser) ablation was proposed for the nanoscale precision removal of Cu in integrated...

Descripción completa

Detalles Bibliográficos
Autores principales: Wang, Shuai, Wang, Yaoyu, Zhang, Shizhuo, Wang, Lingfeng, Chen, Shuai, Zheng, Huai, Zhang, Chen, Liu, Sheng, Cheng, Gary J., Liu, Feng
Formato: Online Artículo Texto
Lenguaje:English
Publicado: MDPI 2021
Materias:
Article
Acceso en línea:https://www.ncbi.nlm.nih.gov/pmc/articles/PMC8537610/
https://www.ncbi.nlm.nih.gov/pubmed/34683239
http://dx.doi.org/10.3390/mi12101188

Internet

https://www.ncbi.nlm.nih.gov/pmc/articles/PMC8537610/
https://www.ncbi.nlm.nih.gov/pubmed/34683239
http://dx.doi.org/10.3390/mi12101188

Ejemplares similares