Cargando…
Nanoscale-Precision Removal of Copper in Integrated Circuits Based on a Hybrid Process of Plasma Oxidation and Femtosecond Laser Ablation
Copper (Cu) is the main interconnect conductor for integrated circuits (IC), and its processing quality is very important to device performance. Herein, a hybrid process of plasma oxidation and femtosecond laser (fs-laser) ablation was proposed for the nanoscale precision removal of Cu in integrated...
Autores principales: | Wang, Shuai, Wang, Yaoyu, Zhang, Shizhuo, Wang, Lingfeng, Chen, Shuai, Zheng, Huai, Zhang, Chen, Liu, Sheng, Cheng, Gary J., Liu, Feng |
---|---|
Formato: | Online Artículo Texto |
Lenguaje: | English |
Publicado: |
MDPI
2021
|
Materias: | |
Acceso en línea: | https://www.ncbi.nlm.nih.gov/pmc/articles/PMC8537610/ https://www.ncbi.nlm.nih.gov/pubmed/34683239 http://dx.doi.org/10.3390/mi12101188 |
Ejemplares similares
-
High-Efficiency Copper Removal by Nitrogen Plasma-Assisted Picosecond Laser Processing
por: Li, Yunfan, et al.
Publicado: (2022) -
Throughput Improvement in Femtosecond Laser Ablation of Nickel by Double Pulses
por: Chu, Kunpeng, et al.
Publicado: (2021) -
Nanoscale Printing of Indium-Tin-Oxide by Femtosecond Laser Pulses
por: Hu, Jingwen, et al.
Publicado: (2022) -
Liquid-Assisted Femtosecond Laser Precision-Machining of Silica
por: Cao, Xiao-Wen, et al.
Publicado: (2018) -
Recent Developments of Femtosecond Laser Direct Writing for Meta-Optics
por: Xu, Shuai, et al.
Publicado: (2023)