Thermal Analysis on Active Heat Dissipation Design with Embedded Flow Channels for Flexible Electronic Devices

Heat generation is a major issue in all electronics, as heat reduces product life, reliability, and performance, especially in flexible electronics with low thermal-conductivity polymeric substrates. In this sense, the active heat dissipation design with flow channels holds great promise. Here, a th...

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Detalles Bibliográficos
Autores principales: Yu, Yanan, Yin, Yafei, Li, Yuhang, Li, Min, Song, Jizhou
Formato: Online Artículo Texto
Lenguaje:English
Publicado: MDPI 2021
Materias:
Article
Acceso en línea:https://www.ncbi.nlm.nih.gov/pmc/articles/PMC8538787/
https://www.ncbi.nlm.nih.gov/pubmed/34683216
http://dx.doi.org/10.3390/mi12101165

Internet

https://www.ncbi.nlm.nih.gov/pmc/articles/PMC8538787/
https://www.ncbi.nlm.nih.gov/pubmed/34683216
http://dx.doi.org/10.3390/mi12101165

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