Thermal Analysis on Active Heat Dissipation Design with Embedded Flow Channels for Flexible Electronic Devices

Heat generation is a major issue in all electronics, as heat reduces product life, reliability, and performance, especially in flexible electronics with low thermal-conductivity polymeric substrates. In this sense, the active heat dissipation design with flow channels holds great promise. Here, a theoretical model, validated by finite element analysis and experiments, based on the method of the separation of variables, is developed to study the thermal behavior of the active heat dissipation design with an embedded flow channel. The influences of temperature and flow velocity of the fluid on heat dissipation performance were systematically investigated. The influence of channel spacing on heat dissipation performance was also studied by finite element analysis. The study shows that performance can be improved by decreasing the fluid temperature or increasing the flow velocity and channel density. These results can help guide the design of active heat dissipation with embedded flow channels to reduce adverse effects due to excessive heating, thus enhancing the performance and longevity of electronic products.