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Thermal Analysis on Active Heat Dissipation Design with Embedded Flow Channels for Flexible Electronic Devices
Heat generation is a major issue in all electronics, as heat reduces product life, reliability, and performance, especially in flexible electronics with low thermal-conductivity polymeric substrates. In this sense, the active heat dissipation design with flow channels holds great promise. Here, a th...
| Autores principales: | , , , , |
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| Formato: | Online Artículo Texto |
| Lenguaje: | English |
| Publicado: |
MDPI
2021
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| Materias: | |
| Acceso en línea: | https://www.ncbi.nlm.nih.gov/pmc/articles/PMC8538787/ https://www.ncbi.nlm.nih.gov/pubmed/34683216 http://dx.doi.org/10.3390/mi12101165 |