Investigation of Integrated Reactive Multilayer Systems for Bonding in Microsystem Technology

For the integration of a reactive multilayer system (iRMS) with a high exothermic reaction enthalpy as a heat source on silicon wafers for low-temperature bonding in the 3D integration and packaging of microsystems, two main conflicting issues should be overcome: heat accumulation arising from the l...

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Detalles Bibliográficos
Autores principales: Bourim, El-Mostafa, Kang, Il-Suk, Kim, Hee Yeoun
Formato: Online Artículo Texto
Lenguaje:English
Publicado: MDPI 2021
Materias:
Article
Acceso en línea:https://www.ncbi.nlm.nih.gov/pmc/articles/PMC8541174/
https://www.ncbi.nlm.nih.gov/pubmed/34683323
http://dx.doi.org/10.3390/mi12101272

Internet

https://www.ncbi.nlm.nih.gov/pmc/articles/PMC8541174/
https://www.ncbi.nlm.nih.gov/pubmed/34683323
http://dx.doi.org/10.3390/mi12101272

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