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Investigation of Integrated Reactive Multilayer Systems for Bonding in Microsystem Technology
For the integration of a reactive multilayer system (iRMS) with a high exothermic reaction enthalpy as a heat source on silicon wafers for low-temperature bonding in the 3D integration and packaging of microsystems, two main conflicting issues should be overcome: heat accumulation arising from the l...
| Autores principales: | , , |
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| Formato: | Online Artículo Texto |
| Lenguaje: | English |
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MDPI
2021
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| Acceso en línea: | https://www.ncbi.nlm.nih.gov/pmc/articles/PMC8541174/ https://www.ncbi.nlm.nih.gov/pubmed/34683323 http://dx.doi.org/10.3390/mi12101272 |