Grain-Scale Anisotropic Analysis of Steady-State Creep in Oligocrystalline SAC Solder Joints

Heterogeneous integration is leading to unprecedented miniaturization of solder joints, often with thousands of joints within a single package. The thermomechanical behavior of such SAC solder joints is critically important to assembly performance and reliability, but can be difficult to predict due...

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Detalles Bibliográficos
Autores principales: Jiang, Qian, Deshpande, Abhishek Nitin, Dasgupta, Abhijit
Formato: Online Artículo Texto
Lenguaje:English
Publicado: MDPI 2021
Materias:
Article
Acceso en línea:https://www.ncbi.nlm.nih.gov/pmc/articles/PMC8541237/
https://www.ncbi.nlm.nih.gov/pubmed/34683563
http://dx.doi.org/10.3390/ma14205973

Internet

https://www.ncbi.nlm.nih.gov/pmc/articles/PMC8541237/
https://www.ncbi.nlm.nih.gov/pubmed/34683563
http://dx.doi.org/10.3390/ma14205973

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