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Grain-Scale Anisotropic Analysis of Steady-State Creep in Oligocrystalline SAC Solder Joints

Heterogeneous integration is leading to unprecedented miniaturization of solder joints, often with thousands of joints within a single package. The thermomechanical behavior of such SAC solder joints is critically important to assembly performance and reliability, but can be difficult to predict due...

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Detalles Bibliográficos
Autores principales:	Jiang, Qian, Deshpande, Abhishek Nitin, Dasgupta, Abhijit
Formato:	Online Artículo Texto
Lenguaje:	English
Publicado:	MDPI 2021
Materias:	Article
Acceso en línea:	https://www.ncbi.nlm.nih.gov/pmc/articles/PMC8541237/ https://www.ncbi.nlm.nih.gov/pubmed/34683563 http://dx.doi.org/10.3390/ma14205973

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