Indium-Based Micro-Bump Array Fabrication Technology with Added Pre-Reflow Wet Etching and Annealing

Indium-based micro-bump arrays, among other things, are used for the bonding of infrared photodetectors and focal plane arrays. In this paper, several aspects of the fabrication technology of micrometer-sized indium bumps with a smooth surface morphology were investigated. The thermal evaporation of...

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Detalles Bibliográficos
Autores principales: Kozłowski, Paweł, Czuba, Krzysztof, Chmielewski, Krzysztof, Ratajczak, Jacek, Branas, Joanna, Korczyc, Adam, Regiński, Kazimierz, Jasik, Agata
Formato: Online Artículo Texto
Lenguaje:English
Publicado: MDPI 2021
Materias:
Article
Acceso en línea:https://www.ncbi.nlm.nih.gov/pmc/articles/PMC8584861/
https://www.ncbi.nlm.nih.gov/pubmed/34771804
http://dx.doi.org/10.3390/ma14216269

Internet

https://www.ncbi.nlm.nih.gov/pmc/articles/PMC8584861/
https://www.ncbi.nlm.nih.gov/pubmed/34771804
http://dx.doi.org/10.3390/ma14216269

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