Characterization of Sn–Sb–Ti Solder Alloy and the Study of Its Use for the Ultrasonic Soldering Process of SiC Ceramics with a Cu–SiC Metal–Ceramic Composite

The aim of this research was to characterize soldering alloys of the type Sn–Sb–Ti and to study the ultrasonic soldering of SiC ceramics with a metal–ceramic composite of the type Cu–SiC. The Sn5Sb3Ti solder exerts a thermal transformation of a peritectic character with an approximate melting point...

Descripción completa

Detalles Bibliográficos
Autores principales: Kolenak, Roman, Kostolny, Igor, Drapala, Jaromir, Babincova, Paulina, Pasak, Matej
Formato: Online Artículo Texto
Lenguaje:English
Publicado: MDPI 2021
Materias:
Article
Acceso en línea:https://www.ncbi.nlm.nih.gov/pmc/articles/PMC8585135/
https://www.ncbi.nlm.nih.gov/pubmed/34771894
http://dx.doi.org/10.3390/ma14216369

Internet

https://www.ncbi.nlm.nih.gov/pmc/articles/PMC8585135/
https://www.ncbi.nlm.nih.gov/pubmed/34771894
http://dx.doi.org/10.3390/ma14216369

Ejemplares similares