FFF 3D Printing in Electronic Applications: Dielectric and Thermal Properties of Selected Polymers

The present study is a focused and comprehensive analysis of the dielectric and thermal properties of twenty-four 3D printed polymers suitable for fused filament fabrication (FFF) in electronic applications. The selected polymers include various thermoplastic elastomers, such as thermoplastics based...

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Detalles Bibliográficos
Autores principales: Kalaš, David, Šíma, Karel, Kadlec, Petr, Polanský, Radek, Soukup, Radek, Řeboun, Jan, Hamáček, Aleš
Formato: Online Artículo Texto
Lenguaje:English
Publicado: MDPI 2021
Materias:
Article
Acceso en línea:https://www.ncbi.nlm.nih.gov/pmc/articles/PMC8587066/
https://www.ncbi.nlm.nih.gov/pubmed/34771261
http://dx.doi.org/10.3390/polym13213702

Internet

https://www.ncbi.nlm.nih.gov/pmc/articles/PMC8587066/
https://www.ncbi.nlm.nih.gov/pubmed/34771261
http://dx.doi.org/10.3390/polym13213702

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