AC Electric-Field Assistant Architecting Ordered Network of Ni@PS Microspheres in Epoxy Resin to Enhance Conductivity

By using the low loading of the conductor filler to achieve high conductivity is a challenge associated with electrically conductive adhesion. In this study, we show an assembling of nickel-coated polystyrene (Ni@PS) microspheres into 3-dimensional network within the epoxy resin with the assistance...

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Detalles Bibliográficos
Autores principales: Han, Zhiliang, Wang, Jinlu, You, Qingliang, Liu, Xueqing, Xiao, Biao, Liu, Zhihong, Liu, Jiyan, Chen, Yuwei
Formato: Online Artículo Texto
Lenguaje:English
Publicado: MDPI 2021
Materias:
Article
Acceso en línea:https://www.ncbi.nlm.nih.gov/pmc/articles/PMC8587127/
https://www.ncbi.nlm.nih.gov/pubmed/34771381
http://dx.doi.org/10.3390/polym13213826

Internet

https://www.ncbi.nlm.nih.gov/pmc/articles/PMC8587127/
https://www.ncbi.nlm.nih.gov/pubmed/34771381
http://dx.doi.org/10.3390/polym13213826

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