High-Density Patterned Array Bonding through Void-Free Divinyl Siloxane Bis-Benzocyclobutene Bonding Process

Divinylsiloxane-bis-benzocyclobutene (DVS-BCB) has attracted significant attention as an intermediate bonding material, owing to its excellent properties. However, its applications are limited, due to damage to peripheral devices at high curing temperatures and unoptimized compressive pressure. Ther...

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Detalles Bibliográficos
Autores principales: Kim, Nam Woon, Choe, Hyeonjeong, Shah, Muhammad Ali, Lee, Duck-Gyu, Hur, Shin
Formato: Online Artículo Texto
Lenguaje:English
Publicado: MDPI 2021
Materias:
Article
Acceso en línea:https://www.ncbi.nlm.nih.gov/pmc/articles/PMC8588381/
https://www.ncbi.nlm.nih.gov/pubmed/34771189
http://dx.doi.org/10.3390/polym13213633

Internet

https://www.ncbi.nlm.nih.gov/pmc/articles/PMC8588381/
https://www.ncbi.nlm.nih.gov/pubmed/34771189
http://dx.doi.org/10.3390/polym13213633

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