Advanced Atomic Layer Deposition Technologies for Micro-LEDs and VCSELs

In recent years, the process requirements of nano-devices have led to the gradual reduction in the scale of semiconductor devices, and the consequent non-negligible sidewall defects caused by etching. Since plasma-enhanced chemical vapor deposition can no longer provide sufficient step coverage, the...

Descripción completa

Detalles Bibliográficos
Autores principales: Yeh, Yen-Wei, Lin, Su-Hui, Hsu, Tsung-Chi, Lai, Shouqiang, Lee, Po-Tsung, Lien, Shui-Yang, Wuu, Dong-Sing, Li, Guisen, Chen, Zhong, Wu, Tingzhu, Kuo, Hao-Chung
Formato: Online Artículo Texto
Lenguaje:English
Publicado: Springer US 2021
Materias:
Nano Review
Acceso en línea:https://www.ncbi.nlm.nih.gov/pmc/articles/PMC8602599/
https://www.ncbi.nlm.nih.gov/pubmed/34792678
http://dx.doi.org/10.1186/s11671-021-03623-x

Internet

https://www.ncbi.nlm.nih.gov/pmc/articles/PMC8602599/
https://www.ncbi.nlm.nih.gov/pubmed/34792678
http://dx.doi.org/10.1186/s11671-021-03623-x

Ejemplares similares