Approaches to Sustainability in Chemical Mechanical Polishing (CMP): A Review

Chemical mechanical polishing (CMP) is an essential planarization process for semiconductor manufacturing. The application of CMP has been increasing in semiconductor fabrication for highly integrated devices. Recently, environmental burden caused by the CMP process was assessed because of interest...

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Detalles Bibliográficos
Autores principales: Lee, Hyunseop, Kim, Hyoungjae, Jeong, Haedo
Formato: Online Artículo Texto
Lenguaje:English
Publicado: Korean Society for Precision Engineering 2021
Materias:
Review
Acceso en línea:https://www.ncbi.nlm.nih.gov/pmc/articles/PMC8617369/
http://dx.doi.org/10.1007/s40684-021-00406-8

Internet

https://www.ncbi.nlm.nih.gov/pmc/articles/PMC8617369/
http://dx.doi.org/10.1007/s40684-021-00406-8

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