Study of Copper-Nickel Nanoparticle Resistive Ink Compatible with Printed Copper Films for Power Electronics Applications

This paper is focused on copper–nickel nanoparticle resistive inks compatible with thick printed copper (TPC) technology, which can be used for power substrate manufacturing instead of conventional metallization techniques. Two types of copper–nickel inks were prepared and deposited by Aerosol Jet t...

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Detalles Bibliográficos
Autores principales: Hlina, Jiri, Reboun, Jan, Hamacek, Ales
Formato: Online Artículo Texto
Lenguaje:English
Publicado: MDPI 2021
Materias:
Article
Acceso en línea:https://www.ncbi.nlm.nih.gov/pmc/articles/PMC8622226/
https://www.ncbi.nlm.nih.gov/pubmed/34832439
http://dx.doi.org/10.3390/ma14227039

Internet

https://www.ncbi.nlm.nih.gov/pmc/articles/PMC8622226/
https://www.ncbi.nlm.nih.gov/pubmed/34832439
http://dx.doi.org/10.3390/ma14227039

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