Tin Whiskers’ Behavior under Stress Load and the Mitigation Method for Immersion Tin Surface Finish

Since the use of the most stable Pb-based materials in the electronic industry has been banned due to human health concerns, numerous research studies have focused on Pb-free materials such as pure tin and its alloys for electronic applications. Pure tin, however, suffers from tin whiskers’ formatio...

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Detalles Bibliográficos
Autores principales: Fadil, Nor Akmal, Yusof, Siti Zahira, Abu Bakar, Tuty Asma, Ghazali, Habibah, Mat Yajid, Muhamad Azizi, Osman, Saliza Azlina, Ourdjini, Ali
Formato: Online Artículo Texto
Lenguaje:English
Publicado: MDPI 2021
Materias:
Article
Acceso en línea:https://www.ncbi.nlm.nih.gov/pmc/articles/PMC8623119/
https://www.ncbi.nlm.nih.gov/pubmed/34832218
http://dx.doi.org/10.3390/ma14226817

Internet

https://www.ncbi.nlm.nih.gov/pmc/articles/PMC8623119/
https://www.ncbi.nlm.nih.gov/pubmed/34832218
http://dx.doi.org/10.3390/ma14226817

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