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Tin Whiskers’ Behavior under Stress Load and the Mitigation Method for Immersion Tin Surface Finish
Since the use of the most stable Pb-based materials in the electronic industry has been banned due to human health concerns, numerous research studies have focused on Pb-free materials such as pure tin and its alloys for electronic applications. Pure tin, however, suffers from tin whiskers’ formatio...
| Autores principales: | , , , , , , |
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| Formato: | Online Artículo Texto |
| Lenguaje: | English |
| Publicado: |
MDPI
2021
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| Materias: | |
| Acceso en línea: | https://www.ncbi.nlm.nih.gov/pmc/articles/PMC8623119/ https://www.ncbi.nlm.nih.gov/pubmed/34832218 http://dx.doi.org/10.3390/ma14226817 |