Thermal Radiative Copper Oxide Layer for Enhancing Heat Dissipation of Metal Surface

The heat dissipation of a metal heat sink for passive cooling can be enhanced by surface modifications to increase its thermal emissivity, which is reflected by a darker surface appearance. In this study, copper electrodeposition followed by heat treatment was applied to a copper substrate. The heat...

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Detalles Bibliográficos
Autores principales: Park, Junghyun, Kim, Donghyun, Kim, Hyunsik, Lee, Junghoon, Chung, Wonsub
Formato: Online Artículo Texto
Lenguaje:English
Publicado: MDPI 2021
Materias:
Article
Acceso en línea:https://www.ncbi.nlm.nih.gov/pmc/articles/PMC8624854/
https://www.ncbi.nlm.nih.gov/pubmed/34835584
http://dx.doi.org/10.3390/nano11112819

Internet

https://www.ncbi.nlm.nih.gov/pmc/articles/PMC8624854/
https://www.ncbi.nlm.nih.gov/pubmed/34835584
http://dx.doi.org/10.3390/nano11112819

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