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Thermal Radiative Copper Oxide Layer for Enhancing Heat Dissipation of Metal Surface
The heat dissipation of a metal heat sink for passive cooling can be enhanced by surface modifications to increase its thermal emissivity, which is reflected by a darker surface appearance. In this study, copper electrodeposition followed by heat treatment was applied to a copper substrate. The heat...
Autores principales: | Park, Junghyun, Kim, Donghyun, Kim, Hyunsik, Lee, Junghoon, Chung, Wonsub |
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Formato: | Online Artículo Texto |
Lenguaje: | English |
Publicado: |
MDPI
2021
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Materias: | |
Acceso en línea: | https://www.ncbi.nlm.nih.gov/pmc/articles/PMC8624854/ https://www.ncbi.nlm.nih.gov/pubmed/34835584 http://dx.doi.org/10.3390/nano11112819 |
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