Influence of Alloying Elements on the Mechanical Properties of Anodized Aluminum and on the Adhesion of Copper Metallization

The active development of the power electronics market and a constant increase in the prices of components require new materials and approaches, including a power module packaging technology. The use of aluminum instead of copper in the power module baseplate is an interesting and promising solution...

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Detalles Bibliográficos
Autores principales: Medvedev, Oleg S., Alyasova, Ekaterina E., Besprozvannaya, Rona E., Gadzhiev, Asadula A., Krivova, Veronika V., Kondratev, Andrey S., Kim, Artem E., Novikov, Pavel A., Popovich, Anatoliy A.
Formato: Online Artículo Texto
Lenguaje:English
Publicado: MDPI 2021
Materias:
Article
Acceso en línea:https://www.ncbi.nlm.nih.gov/pmc/articles/PMC8624961/
https://www.ncbi.nlm.nih.gov/pubmed/34832426
http://dx.doi.org/10.3390/ma14227028

Internet

https://www.ncbi.nlm.nih.gov/pmc/articles/PMC8624961/
https://www.ncbi.nlm.nih.gov/pubmed/34832426
http://dx.doi.org/10.3390/ma14227028

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