An Extended Analytical Solution of the Non-Stationary Heat Conduction Problem in Multi-Track Thick-Walled Products during the Additive Manufacturing Process

An analytical model has been developed for calculating three-dimensional transient temperature fields arising in the direct deposition process to study the thermal behavior of multi-track walls with various configurations. The model allows the calculation of all characteristics of the temperature fi...

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Detalles Bibliográficos
Autores principales: Mukin, Dmitrii, Valdaytseva, Ekaterina, Turichin, Gleb, Vildanov, Artur
Formato: Online Artículo Texto
Lenguaje:English
Publicado: MDPI 2021
Materias:
Article
Acceso en línea:https://www.ncbi.nlm.nih.gov/pmc/articles/PMC8658187/
https://www.ncbi.nlm.nih.gov/pubmed/34885446
http://dx.doi.org/10.3390/ma14237291

Internet

https://www.ncbi.nlm.nih.gov/pmc/articles/PMC8658187/
https://www.ncbi.nlm.nih.gov/pubmed/34885446
http://dx.doi.org/10.3390/ma14237291

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