Direct gold bonding for flexible integrated electronics

Flexible and stable interconnections are critical for the next generation of shape-conformable and wearable electronics. These interconnections should have metal-like conductivity and sufficiently low stiffness that does not compromise the flexibility of the device; moreover, they must be achieved u...

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Detalles Bibliográficos
Autores principales: Takakuwa, Masahito, Fukuda, Kenjiro, Yokota, Tomoyuki, Inoue, Daishi, Hashizume, Daisuke, Umezu, Shinjiro, Someya, Takao
Formato: Online Artículo Texto
Lenguaje:English
Publicado: American Association for the Advancement of Science 2021
Materias:
Physical and Materials Sciences
Acceso en línea:https://www.ncbi.nlm.nih.gov/pmc/articles/PMC8694591/
https://www.ncbi.nlm.nih.gov/pubmed/34936437
http://dx.doi.org/10.1126/sciadv.abl6228

Internet

https://www.ncbi.nlm.nih.gov/pmc/articles/PMC8694591/
https://www.ncbi.nlm.nih.gov/pubmed/34936437
http://dx.doi.org/10.1126/sciadv.abl6228

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