Cargando…
Direct gold bonding for flexible integrated electronics
Flexible and stable interconnections are critical for the next generation of shape-conformable and wearable electronics. These interconnections should have metal-like conductivity and sufficiently low stiffness that does not compromise the flexibility of the device; moreover, they must be achieved u...
| Autores principales: | , , , , , , |
|---|---|
| Formato: | Online Artículo Texto |
| Lenguaje: | English |
| Publicado: |
American Association for the Advancement of Science
2021
|
| Materias: | |
| Acceso en línea: | https://www.ncbi.nlm.nih.gov/pmc/articles/PMC8694591/ https://www.ncbi.nlm.nih.gov/pubmed/34936437 http://dx.doi.org/10.1126/sciadv.abl6228 |