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Metal-Assisted Chemical Etching for Anisotropic Deep Trenching of GaN Array
Realizing the anisotropic deep trenching of GaN without surface damage is essential for the fabrication of GaN-based devices. However, traditional dry etching technologies introduce irreversible damage to GaN and degrade the performance of the device. In this paper, we demonstrate a damage-free, rap...
Autores principales: | Wang, Qi, Zhou, Kehong, Zhao, Shuai, Yang, Wen, Zhang, Hongsheng, Yan, Wensheng, Huang, Yi, Yuan, Guodong |
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Formato: | Online Artículo Texto |
Lenguaje: | English |
Publicado: |
MDPI
2021
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Materias: | |
Acceso en línea: | https://www.ncbi.nlm.nih.gov/pmc/articles/PMC8704282/ https://www.ncbi.nlm.nih.gov/pubmed/34947528 http://dx.doi.org/10.3390/nano11123179 |
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