Effect of Ni(P) Layer Thickness on Interface Reaction and Reliability of Ultrathin ENEPIG Surface Finish

Electroless Ni(P)/electroless Pd/immersion Au (ENEPIG) is a common surface finish in electronic packaging, while the Ni(P) layer increases the impedance of solder joints and leads to signal quality degradation in high-frequency circuits. Reducing the thickness of the Ni(P) layer can balance the high...

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Detalles Bibliográficos
Autores principales: Chi, Panwang, Li, Yesu, Pan, Hongfa, Wang, Yibo, Chen, Nancheng, Li, Ming, Gao, Liming
Formato: Online Artículo Texto
Lenguaje:English
Publicado: MDPI 2021
Materias:
Article
Acceso en línea:https://www.ncbi.nlm.nih.gov/pmc/articles/PMC8704334/
https://www.ncbi.nlm.nih.gov/pubmed/34947470
http://dx.doi.org/10.3390/ma14247874

Internet

https://www.ncbi.nlm.nih.gov/pmc/articles/PMC8704334/
https://www.ncbi.nlm.nih.gov/pubmed/34947470
http://dx.doi.org/10.3390/ma14247874

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