Influence of Flux and Related Factors on Intermetallic Layer Growth within SAC305 Solder Joints

Flux contained in solder paste significantly affects the process of solder joint creation during reflow soldering, including the creation of an intermetallic layer (IML). This work investigates the dependence of intermetallic layer thickness on ROL0/ROL1 flux classification, glossy or matt solder ma...

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Detalles Bibliográficos
Autores principales: Dušek, Karel, Veselý, Petr, Bušek, David, Petráč, Adam, Géczy, Attila, Illés, Balázs, Krammer, Oliver
Formato: Online Artículo Texto
Lenguaje:English
Publicado: MDPI 2021
Materias:
Article
Acceso en línea:https://www.ncbi.nlm.nih.gov/pmc/articles/PMC8706145/
https://www.ncbi.nlm.nih.gov/pubmed/34947502
http://dx.doi.org/10.3390/ma14247909

Internet

https://www.ncbi.nlm.nih.gov/pmc/articles/PMC8706145/
https://www.ncbi.nlm.nih.gov/pubmed/34947502
http://dx.doi.org/10.3390/ma14247909

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