Wafer-Level 3D Integration Based on Poly (Diallyl Phthalate) Adhesive Bonding

Three-dimensional integration technology provides a promising total solution that can be used to achieve system-level integration with high function density and low cost. In this study, a wafer-level 3D integration technology using PDAP as an intermediate bonding polymer was applied effectively for...

Descripción completa

Detalles Bibliográficos
Autores principales: Fang, Zhong, You, Peng, Jia, Yijie, Pan, Xuchao, Shi, Yunlei, Jiao, Junjie, He, Yong
Formato: Online Artículo Texto
Lenguaje:English
Publicado: MDPI 2021
Materias:
Communication
Acceso en línea:https://www.ncbi.nlm.nih.gov/pmc/articles/PMC8707114/
https://www.ncbi.nlm.nih.gov/pubmed/34945436
http://dx.doi.org/10.3390/mi12121586

Internet

https://www.ncbi.nlm.nih.gov/pmc/articles/PMC8707114/
https://www.ncbi.nlm.nih.gov/pubmed/34945436
http://dx.doi.org/10.3390/mi12121586

Ejemplares similares