Realization of Three-Dimensionally MEMS Stacked Comb Structures for Microactuators Using Low-Temperature Multi-Wafer Bonding with Self-Alignment Techniques in CMOS-Compatible Processes

A high-aspect-ratio three-dimensionally (3D) stacked comb structure for micromirror application is demonstrated by wafer bonding technology in CMOS-compatible processes in this work. A vertically stacked comb structure is designed to circumvent any misalignment issues that could arise from multiple...

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Detalles Bibliográficos
Autores principales: Teo, Adrian J. T., Li, King Ho Holden
Formato: Online Artículo Texto
Lenguaje:English
Publicado: MDPI 2021
Materias:
Article
Acceso en línea:https://www.ncbi.nlm.nih.gov/pmc/articles/PMC8708440/
https://www.ncbi.nlm.nih.gov/pubmed/34945331
http://dx.doi.org/10.3390/mi12121481

Internet

https://www.ncbi.nlm.nih.gov/pmc/articles/PMC8708440/
https://www.ncbi.nlm.nih.gov/pubmed/34945331
http://dx.doi.org/10.3390/mi12121481

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