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Neural network-based cooling design for high-performance processors
Ultra-high chip power densities that are expected to surpass 1-2kW/cm(2) in future high-performance systems cannot be easily handled by conventional cooling methods. Various emerging cooling methods, such as liquid cooling via microchannels, thermoelectric coolers (TECs), two-phase vapor chambers, a...
| Autores principales: | , |
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| Formato: | Online Artículo Texto |
| Lenguaje: | English |
| Publicado: |
Elsevier
2021
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| Acceso en línea: | https://www.ncbi.nlm.nih.gov/pmc/articles/PMC8717464/ https://www.ncbi.nlm.nih.gov/pubmed/35005532 http://dx.doi.org/10.1016/j.isci.2021.103582 |