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Study on the Strip Warpage Issues Encountered in the Flip-Chip Process
This study successfully established a strip warpage simulation model of the flip-chip process and investigated the effects of structural design and process (molding, post-mold curing, pretreatment, and ball mounting) on strip warpage. The errors between simulated and experimental values were found t...
| Autores principales: | , |
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| Formato: | Online Artículo Texto |
| Lenguaje: | English |
| Publicado: |
MDPI
2022
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| Acceso en línea: | https://www.ncbi.nlm.nih.gov/pmc/articles/PMC8745822/ https://www.ncbi.nlm.nih.gov/pubmed/35009468 http://dx.doi.org/10.3390/ma15010323 |