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Study on the Strip Warpage Issues Encountered in the Flip-Chip Process

This study successfully established a strip warpage simulation model of the flip-chip process and investigated the effects of structural design and process (molding, post-mold curing, pretreatment, and ball mounting) on strip warpage. The errors between simulated and experimental values were found t...

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Detalles Bibliográficos
Autores principales:	Chuang, Wan-Chun, Chen, Wei-Long
Formato:	Online Artículo Texto
Lenguaje:	English
Publicado:	MDPI 2022
Materias:	Article
Acceso en línea:	https://www.ncbi.nlm.nih.gov/pmc/articles/PMC8745822/ https://www.ncbi.nlm.nih.gov/pubmed/35009468 http://dx.doi.org/10.3390/ma15010323

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