The Effect of Grain Orientation of β-Sn on Copper Pillar Solder Joints during Electromigration

The grain orientation of Sn-based solder joints on copper pillars under the combined action of electron wind force and temperature gradient greatly affects their electromigration damage. The copper pillars with Sn-1.8Ag lead-free solder on the top was subjected to a current density of 1.5 × 10(4) A/...

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Detalles Bibliográficos
Autores principales: Xu, Kexin, Fu, Xing, Wang, Xinjie, Fu, Zhiwei, Yang, Xiaofeng, Chen, Si, Shi, Yijun, Huang, Yun, Chen, Hongtao
Formato: Online Artículo Texto
Lenguaje:English
Publicado: MDPI 2021
Materias:
Article
Acceso en línea:https://www.ncbi.nlm.nih.gov/pmc/articles/PMC8745900/
https://www.ncbi.nlm.nih.gov/pubmed/35009255
http://dx.doi.org/10.3390/ma15010108

Internet

https://www.ncbi.nlm.nih.gov/pmc/articles/PMC8745900/
https://www.ncbi.nlm.nih.gov/pubmed/35009255
http://dx.doi.org/10.3390/ma15010108

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