The Effect of Grain Orientation of β-Sn on Copper Pillar Solder Joints during Electromigration

The grain orientation of Sn-based solder joints on copper pillars under the combined action of electron wind force and temperature gradient greatly affects their electromigration damage. The copper pillars with Sn-1.8Ag lead-free solder on the top was subjected to a current density of 1.5 × 10(4) A/...

Descripción completa

Detalles Bibliográficos
Autores principales: Xu, Kexin, Fu, Xing, Wang, Xinjie, Fu, Zhiwei, Yang, Xiaofeng, Chen, Si, Shi, Yijun, Huang, Yun, Chen, Hongtao
Formato: Online Artículo Texto
Lenguaje:English
Publicado: MDPI 2021
Materias:
Article
Acceso en línea:https://www.ncbi.nlm.nih.gov/pmc/articles/PMC8745900/
https://www.ncbi.nlm.nih.gov/pubmed/35009255
http://dx.doi.org/10.3390/ma15010108
Descripción
Sumario:The grain orientation of Sn-based solder joints on copper pillars under the combined action of electron wind force and temperature gradient greatly affects their electromigration damage. The copper pillars with Sn-1.8Ag lead-free solder on the top was subjected to a current density of 1.5 × 10(4) A/cm(2) at 125 °C to study the electromigration behaviors. The grain orientation was characterized by scanning electron microscopy (SEM) equipped with electron backscattered diffraction (EBSD) detector. Metal dissolution and voids formation in the cathode as well as massive intermetallic compounds(IMC) accumulation in the anode were observed after electromigration. Closer examination of solder joints revealed that the Sn grain whose c-axis perpendicular to electric current may have retarded Cu diffusion to anode and IMC accumulation. In addition, the newly formed Cu(6)Sn(5) exhibited preferred orientation related to the electric current direction.

Ejemplares similares