The Effect of Grain Orientation of β-Sn on Copper Pillar Solder Joints during Electromigration

The grain orientation of Sn-based solder joints on copper pillars under the combined action of electron wind force and temperature gradient greatly affects their electromigration damage. The copper pillars with Sn-1.8Ag lead-free solder on the top was subjected to a current density of 1.5 × 10(4) A/...

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Autores principales: Xu, Kexin, Fu, Xing, Wang, Xinjie, Fu, Zhiwei, Yang, Xiaofeng, Chen, Si, Shi, Yijun, Huang, Yun, Chen, Hongtao
Formato: Online Artículo Texto
Lenguaje:English
Publicado: MDPI 2021
Materias:
Article
Acceso en línea:https://www.ncbi.nlm.nih.gov/pmc/articles/PMC8745900/
https://www.ncbi.nlm.nih.gov/pubmed/35009255
http://dx.doi.org/10.3390/ma15010108
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author Xu, Kexin
Fu, Xing
Wang, Xinjie
Fu, Zhiwei
Yang, Xiaofeng
Chen, Si
Shi, Yijun
Huang, Yun
Chen, Hongtao
author_facet Xu, Kexin
Fu, Xing
Wang, Xinjie
Fu, Zhiwei
Yang, Xiaofeng
Chen, Si
Shi, Yijun
Huang, Yun
Chen, Hongtao
author_sort Xu, Kexin
collection PubMed
description The grain orientation of Sn-based solder joints on copper pillars under the combined action of electron wind force and temperature gradient greatly affects their electromigration damage. The copper pillars with Sn-1.8Ag lead-free solder on the top was subjected to a current density of 1.5 × 10(4) A/cm(2) at 125 °C to study the electromigration behaviors. The grain orientation was characterized by scanning electron microscopy (SEM) equipped with electron backscattered diffraction (EBSD) detector. Metal dissolution and voids formation in the cathode as well as massive intermetallic compounds(IMC) accumulation in the anode were observed after electromigration. Closer examination of solder joints revealed that the Sn grain whose c-axis perpendicular to electric current may have retarded Cu diffusion to anode and IMC accumulation. In addition, the newly formed Cu(6)Sn(5) exhibited preferred orientation related to the electric current direction.
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spelling pubmed-87459002022-01-11 The Effect of Grain Orientation of β-Sn on Copper Pillar Solder Joints during Electromigration Xu, Kexin Fu, Xing Wang, Xinjie Fu, Zhiwei Yang, Xiaofeng Chen, Si Shi, Yijun Huang, Yun Chen, Hongtao Materials (Basel) Article The grain orientation of Sn-based solder joints on copper pillars under the combined action of electron wind force and temperature gradient greatly affects their electromigration damage. The copper pillars with Sn-1.8Ag lead-free solder on the top was subjected to a current density of 1.5 × 10(4) A/cm(2) at 125 °C to study the electromigration behaviors. The grain orientation was characterized by scanning electron microscopy (SEM) equipped with electron backscattered diffraction (EBSD) detector. Metal dissolution and voids formation in the cathode as well as massive intermetallic compounds(IMC) accumulation in the anode were observed after electromigration. Closer examination of solder joints revealed that the Sn grain whose c-axis perpendicular to electric current may have retarded Cu diffusion to anode and IMC accumulation. In addition, the newly formed Cu(6)Sn(5) exhibited preferred orientation related to the electric current direction. MDPI 2021-12-24 /pmc/articles/PMC8745900/ /pubmed/35009255 http://dx.doi.org/10.3390/ma15010108 Text en © 2021 by the authors. https://creativecommons.org/licenses/by/4.0/Licensee MDPI, Basel, Switzerland. This article is an open access article distributed under the terms and conditions of the Creative Commons Attribution (CC BY) license (https://creativecommons.org/licenses/by/4.0/).
spellingShingle Article
Xu, Kexin
Fu, Xing
Wang, Xinjie
Fu, Zhiwei
Yang, Xiaofeng
Chen, Si
Shi, Yijun
Huang, Yun
Chen, Hongtao
The Effect of Grain Orientation of β-Sn on Copper Pillar Solder Joints during Electromigration
title The Effect of Grain Orientation of β-Sn on Copper Pillar Solder Joints during Electromigration
title_full The Effect of Grain Orientation of β-Sn on Copper Pillar Solder Joints during Electromigration
title_fullStr The Effect of Grain Orientation of β-Sn on Copper Pillar Solder Joints during Electromigration
title_full_unstemmed The Effect of Grain Orientation of β-Sn on Copper Pillar Solder Joints during Electromigration
title_short The Effect of Grain Orientation of β-Sn on Copper Pillar Solder Joints during Electromigration
title_sort effect of grain orientation of β-sn on copper pillar solder joints during electromigration
topic Article
url https://www.ncbi.nlm.nih.gov/pmc/articles/PMC8745900/
https://www.ncbi.nlm.nih.gov/pubmed/35009255
http://dx.doi.org/10.3390/ma15010108
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