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The Effect of Grain Orientation of β-Sn on Copper Pillar Solder Joints during Electromigration
The grain orientation of Sn-based solder joints on copper pillars under the combined action of electron wind force and temperature gradient greatly affects their electromigration damage. The copper pillars with Sn-1.8Ag lead-free solder on the top was subjected to a current density of 1.5 × 10(4) A/...
| Autores principales: | , , , , , , , , |
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| Formato: | Online Artículo Texto |
| Lenguaje: | English |
| Publicado: |
MDPI
2021
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| Materias: | |
| Acceso en línea: | https://www.ncbi.nlm.nih.gov/pmc/articles/PMC8745900/ https://www.ncbi.nlm.nih.gov/pubmed/35009255 http://dx.doi.org/10.3390/ma15010108 |