Design and implementation of thermal collection networks in 3-D IC structures

The empirical affirmation in the electronics industry is that the power of chips per unit area is growing exponentially. The amount of heat generated is equal to the power; hence as power per unit area increases, so does the amount of heat generated within the chip. Thus, it necessary to mitigate th...

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Detalles Bibliográficos
Autores principales: Patil, Chandrashekhar V., Suma, M.S.
Formato: Online Artículo Texto
Lenguaje:English
Publicado: Elsevier 2022
Materias:
Research Article
Acceso en línea:https://www.ncbi.nlm.nih.gov/pmc/articles/PMC8760542/
https://www.ncbi.nlm.nih.gov/pubmed/35059517
http://dx.doi.org/10.1016/j.heliyon.2022.e08719

Internet

https://www.ncbi.nlm.nih.gov/pmc/articles/PMC8760542/
https://www.ncbi.nlm.nih.gov/pubmed/35059517
http://dx.doi.org/10.1016/j.heliyon.2022.e08719

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