Cargando…
Design and implementation of thermal collection networks in 3-D IC structures
The empirical affirmation in the electronics industry is that the power of chips per unit area is growing exponentially. The amount of heat generated is equal to the power; hence as power per unit area increases, so does the amount of heat generated within the chip. Thus, it necessary to mitigate th...
| Autores principales: | , |
|---|---|
| Formato: | Online Artículo Texto |
| Lenguaje: | English |
| Publicado: |
Elsevier
2022
|
| Materias: | |
| Acceso en línea: | https://www.ncbi.nlm.nih.gov/pmc/articles/PMC8760542/ https://www.ncbi.nlm.nih.gov/pubmed/35059517 http://dx.doi.org/10.1016/j.heliyon.2022.e08719 |