Research on Heat Dissipation of Multi-Chip LED Filament Package

By studying the substrate material, structure, chip distribution, and array form of the multi-chip light-emitting diode (LED) package, the heat-dissipation capacity of the LED package is improved. Finite element analysis and steady-state thermal analysis are used to simulate and analyze LED packages...

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Detalles Bibliográficos
Autores principales: Tan, Lipeng, Liu, Peisheng, She, Chenhui, Xu, Pengpeng, Yan, Lei, Quan, Hui
Formato: Online Artículo Texto
Lenguaje:English
Publicado: MDPI 2021
Materias:
Article
Acceso en línea:https://www.ncbi.nlm.nih.gov/pmc/articles/PMC8780872/
https://www.ncbi.nlm.nih.gov/pubmed/35056241
http://dx.doi.org/10.3390/mi13010077

Internet

https://www.ncbi.nlm.nih.gov/pmc/articles/PMC8780872/
https://www.ncbi.nlm.nih.gov/pubmed/35056241
http://dx.doi.org/10.3390/mi13010077

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