Chemically controlled megasonic cleaning of patterned structures using solutions with dissolved gas and surfactant

Acoustic cavitation is used for megasonic cleaning in the semiconductor industry, especially of wafers with fragile pattern structures. Control of transient cavitation is necessary to achieve high particle removal efficiency (PRE) and low pattern damage (PD). In this study, the cleaning performance...

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Detalles Bibliográficos
Autores principales: Sahoo, Bichitra Nanda, Han, So Young, Kim, Hyun-Tae, Ando, Keita, Kim, Tae-Gon, Kang, Bong-Kyun, Klipp, Andreas, Yerriboina, Nagendra Prasad, Park, Jin-Goo
Formato: Online Artículo Texto
Lenguaje:English
Publicado: Elsevier 2021
Materias:
Short Communication
Acceso en línea:https://www.ncbi.nlm.nih.gov/pmc/articles/PMC8799594/
https://www.ncbi.nlm.nih.gov/pubmed/34969001
http://dx.doi.org/10.1016/j.ultsonch.2021.105859

Internet

https://www.ncbi.nlm.nih.gov/pmc/articles/PMC8799594/
https://www.ncbi.nlm.nih.gov/pubmed/34969001
http://dx.doi.org/10.1016/j.ultsonch.2021.105859

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