Electrodeposition as an Alternative Approach for Monolithic Integration of InSb on Silicon

High-performance electronics would greatly benefit from a versatile III-V integration process on silicon. Unfortunately, integration using hetero epitaxy is hampered by polarity, lattice, and thermal expansion mismatch. This work proposes an alternative concept of III-V integration combining advanta...

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Detalles Bibliográficos
Autores principales: Hnida-Gut, Katarzyna E., Sousa, Marilyne, Hopstaken, Marinus, Reidt, Steffen, Moselund, Kirsten, Schmid, Heinz
Formato: Online Artículo Texto
Lenguaje:English
Publicado: Frontiers Media S.A. 2022
Materias:
Chemistry
Acceso en línea:https://www.ncbi.nlm.nih.gov/pmc/articles/PMC8811445/
https://www.ncbi.nlm.nih.gov/pubmed/35127653
http://dx.doi.org/10.3389/fchem.2021.810256

Internet

https://www.ncbi.nlm.nih.gov/pmc/articles/PMC8811445/
https://www.ncbi.nlm.nih.gov/pubmed/35127653
http://dx.doi.org/10.3389/fchem.2021.810256

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