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Electrodeposition as an Alternative Approach for Monolithic Integration of InSb on Silicon
High-performance electronics would greatly benefit from a versatile III-V integration process on silicon. Unfortunately, integration using hetero epitaxy is hampered by polarity, lattice, and thermal expansion mismatch. This work proposes an alternative concept of III-V integration combining advanta...
| Autores principales: | , , , , , |
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| Formato: | Online Artículo Texto |
| Lenguaje: | English |
| Publicado: |
Frontiers Media S.A.
2022
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| Materias: | |
| Acceso en línea: | https://www.ncbi.nlm.nih.gov/pmc/articles/PMC8811445/ https://www.ncbi.nlm.nih.gov/pubmed/35127653 http://dx.doi.org/10.3389/fchem.2021.810256 |