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Physicochemical Characteristics and Occupational Exposure of Silica Particles as Byproducts in a Semiconductor Sub Fab
This study aimed to elucidate the physicochemical characteristics and occupational exposure of silica powder and airborne particles as byproducts generated from the first scrubbers of chemical vapor deposition and diffusion processes during maintenance in a semiconductor facility sub fab to reduce u...
Autores principales: | , |
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Formato: | Online Artículo Texto |
Lenguaje: | English |
Publicado: |
MDPI
2022
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Materias: | |
Acceso en línea: | https://www.ncbi.nlm.nih.gov/pmc/articles/PMC8835547/ https://www.ncbi.nlm.nih.gov/pubmed/35162814 http://dx.doi.org/10.3390/ijerph19031791 |
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author | Choi, Kwang-Min Lee, Soo-Jin |
author_facet | Choi, Kwang-Min Lee, Soo-Jin |
author_sort | Choi, Kwang-Min |
collection | PubMed |
description | This study aimed to elucidate the physicochemical characteristics and occupational exposure of silica powder and airborne particles as byproducts generated from the first scrubbers of chemical vapor deposition and diffusion processes during maintenance in a semiconductor facility sub fab to reduce unknown risk factors. The chemical composition, size, morphology, and crystal structure of powder and airborne particles as byproducts were investigated using a scanning electron microscopy and transmission electron microscopy equipped with an energy dispersive X-ray spectroscopy, and an X-ray diffraction. The number and mass concentration measurements of airborne particles were performed by using an optical particle sizer of a direct-reading aerosol monitor. All powder and airborne particle samples were mainly composed of oxygen (O) and silicon (Si), which means silica. The byproduct particles were spherical and/or nearly spherical and the particle size ranged from 10 to 90 nm, based on primary particles. Most of the particles were usually agglomerated within a particle size range from approximately 100 nm to 35 µm. In addition, most of the powder samples exhibited diffraction patterns with a broad and relatively low intensity at 2θ degrees 21.6–26.7°, which is similar to that of pure amorphous silica. The above results show the byproduct particles are amorphous silica, which are considered a less toxic foam compared to crystalline silica. The number and mass concentrations of PM10 (particles less than 10 µm in diameter) ranged from 4.250–78.466 particles/cm(3) and 0.939–735.531 µg/m(3), respectively. In addition, 0.3–1.0 and 2.5–10 µm particles occupied the highest portion of the number and mass concentrations, respectively. Meanwhile, several peak exposure patterns were observed at a specific step, which is the process of removing powder particles on the inner chamber and cleaning the chamber by using a vacuum cleaner and a clean wiper, during the maintenance task. |
format | Online Article Text |
id | pubmed-8835547 |
institution | National Center for Biotechnology Information |
language | English |
publishDate | 2022 |
publisher | MDPI |
record_format | MEDLINE/PubMed |
spelling | pubmed-88355472022-02-12 Physicochemical Characteristics and Occupational Exposure of Silica Particles as Byproducts in a Semiconductor Sub Fab Choi, Kwang-Min Lee, Soo-Jin Int J Environ Res Public Health Article This study aimed to elucidate the physicochemical characteristics and occupational exposure of silica powder and airborne particles as byproducts generated from the first scrubbers of chemical vapor deposition and diffusion processes during maintenance in a semiconductor facility sub fab to reduce unknown risk factors. The chemical composition, size, morphology, and crystal structure of powder and airborne particles as byproducts were investigated using a scanning electron microscopy and transmission electron microscopy equipped with an energy dispersive X-ray spectroscopy, and an X-ray diffraction. The number and mass concentration measurements of airborne particles were performed by using an optical particle sizer of a direct-reading aerosol monitor. All powder and airborne particle samples were mainly composed of oxygen (O) and silicon (Si), which means silica. The byproduct particles were spherical and/or nearly spherical and the particle size ranged from 10 to 90 nm, based on primary particles. Most of the particles were usually agglomerated within a particle size range from approximately 100 nm to 35 µm. In addition, most of the powder samples exhibited diffraction patterns with a broad and relatively low intensity at 2θ degrees 21.6–26.7°, which is similar to that of pure amorphous silica. The above results show the byproduct particles are amorphous silica, which are considered a less toxic foam compared to crystalline silica. The number and mass concentrations of PM10 (particles less than 10 µm in diameter) ranged from 4.250–78.466 particles/cm(3) and 0.939–735.531 µg/m(3), respectively. In addition, 0.3–1.0 and 2.5–10 µm particles occupied the highest portion of the number and mass concentrations, respectively. Meanwhile, several peak exposure patterns were observed at a specific step, which is the process of removing powder particles on the inner chamber and cleaning the chamber by using a vacuum cleaner and a clean wiper, during the maintenance task. MDPI 2022-02-04 /pmc/articles/PMC8835547/ /pubmed/35162814 http://dx.doi.org/10.3390/ijerph19031791 Text en © 2022 by the authors. https://creativecommons.org/licenses/by/4.0/Licensee MDPI, Basel, Switzerland. This article is an open access article distributed under the terms and conditions of the Creative Commons Attribution (CC BY) license (https://creativecommons.org/licenses/by/4.0/). |
spellingShingle | Article Choi, Kwang-Min Lee, Soo-Jin Physicochemical Characteristics and Occupational Exposure of Silica Particles as Byproducts in a Semiconductor Sub Fab |
title | Physicochemical Characteristics and Occupational Exposure of Silica Particles as Byproducts in a Semiconductor Sub Fab |
title_full | Physicochemical Characteristics and Occupational Exposure of Silica Particles as Byproducts in a Semiconductor Sub Fab |
title_fullStr | Physicochemical Characteristics and Occupational Exposure of Silica Particles as Byproducts in a Semiconductor Sub Fab |
title_full_unstemmed | Physicochemical Characteristics and Occupational Exposure of Silica Particles as Byproducts in a Semiconductor Sub Fab |
title_short | Physicochemical Characteristics and Occupational Exposure of Silica Particles as Byproducts in a Semiconductor Sub Fab |
title_sort | physicochemical characteristics and occupational exposure of silica particles as byproducts in a semiconductor sub fab |
topic | Article |
url | https://www.ncbi.nlm.nih.gov/pmc/articles/PMC8835547/ https://www.ncbi.nlm.nih.gov/pubmed/35162814 http://dx.doi.org/10.3390/ijerph19031791 |
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