Cargando…
Physicochemical Characteristics and Occupational Exposure of Silica Particles as Byproducts in a Semiconductor Sub Fab
This study aimed to elucidate the physicochemical characteristics and occupational exposure of silica powder and airborne particles as byproducts generated from the first scrubbers of chemical vapor deposition and diffusion processes during maintenance in a semiconductor facility sub fab to reduce u...
Autores principales: | Choi, Kwang-Min, Lee, Soo-Jin |
---|---|
Formato: | Online Artículo Texto |
Lenguaje: | English |
Publicado: |
MDPI
2022
|
Materias: | |
Acceso en línea: | https://www.ncbi.nlm.nih.gov/pmc/articles/PMC8835547/ https://www.ncbi.nlm.nih.gov/pubmed/35162814 http://dx.doi.org/10.3390/ijerph19031791 |
Ejemplares similares
-
Ranking routes in semiconductor wafer fabs
por: Gupta, Shreya, et al.
Publicado: (2023) -
Semiconductor industry: wafer fab exhaust management
por: Sherer, Michael J
Publicado: (2005) -
Non-occupational exposure to silica dust
por: Bhagia, L. J.
Publicado: (2012) -
Occupational exposure to crystalline silica and autoimmune disease.
por: Parks, C G, et al.
Publicado: (1999) -
Occupational Silica Exposure and Pericarditis: An Uncommon Link
por: Hein, Aung, et al.
Publicado: (2023)