Microstructure Evolution and Shear Strength of the Cu/Au80Sn20/Cu Solder Joints with Multiple Reflow Temperatures

In order to present the multiple reflow process during electronic packaging, the influence of the different short-time reheating temperatures on the microstructure and shear strength of the Cu/Au80Sn20/Cu solder joints was studied and discussed. The results showed that high-quality Cu/Au80Sn20/Cu so...

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Detalles Bibliográficos
Autores principales: Chen, Chaoyu, Sun, Mingxu, Cheng, Zhi, Liang, Yao
Formato: Online Artículo Texto
Lenguaje:English
Publicado: MDPI 2022
Materias:
Article
Acceso en línea:https://www.ncbi.nlm.nih.gov/pmc/articles/PMC8836702/
https://www.ncbi.nlm.nih.gov/pubmed/35160725
http://dx.doi.org/10.3390/ma15030780

Internet

https://www.ncbi.nlm.nih.gov/pmc/articles/PMC8836702/
https://www.ncbi.nlm.nih.gov/pubmed/35160725
http://dx.doi.org/10.3390/ma15030780

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