The Investigation of the Effect of Filler Sizes in 3D-BN Skeletons on Thermal Conductivity of Epoxy-Based Composites

Thermally conductive and electrically insulating materials have attracted much attention due to their applications in the field of microelectronics, but through-plane thermal conductivity of materials is still low at present. In this paper, a simple and environmentally friendly strategy is proposed...

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Detalles Bibliográficos
Autores principales: Wang, Zhengdong, Zhang, Tong, Wang, Jinkai, Yang, Ganqiu, Li, Mengli, Wu, Guanglei
Formato: Online Artículo Texto
Lenguaje:English
Publicado: MDPI 2022
Materias:
Article
Acceso en línea:https://www.ncbi.nlm.nih.gov/pmc/articles/PMC8839376/
https://www.ncbi.nlm.nih.gov/pubmed/35159791
http://dx.doi.org/10.3390/nano12030446

Internet

https://www.ncbi.nlm.nih.gov/pmc/articles/PMC8839376/
https://www.ncbi.nlm.nih.gov/pubmed/35159791
http://dx.doi.org/10.3390/nano12030446

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