A Multilayer Paste Based on Ag Nanoparticles with Cu@Sn for Die Attachment in Power Device Packaging

A 3–5 μm Cu@Sn core-shell powder was prepared by chemical plating. Based on the mixture of this Cu@Sn and Ag NPs (nanoparticles), a soldering material for third-generation semiconductors was prepared. The joints prepared with this soldering material had a shear strength of over 40 MPa at 25 °C. This...

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Detalles Bibliográficos
Autores principales: Wang, Jintao, Wang, Xinjie, Zhang, Lin, Zhang, Luobin, Duan, Fangcheng, Wang, Fengyi, Zhang, Weiwei, Wang, Jianqiang, Zhang, Zheng, Hang, Chunjin, Chen, Hongtao
Formato: Online Artículo Texto
Lenguaje:English
Publicado: MDPI 2022
Materias:
Article
Acceso en línea:https://www.ncbi.nlm.nih.gov/pmc/articles/PMC8840178/
https://www.ncbi.nlm.nih.gov/pubmed/35160861
http://dx.doi.org/10.3390/ma15030914

Internet

https://www.ncbi.nlm.nih.gov/pmc/articles/PMC8840178/
https://www.ncbi.nlm.nih.gov/pubmed/35160861
http://dx.doi.org/10.3390/ma15030914

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