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Large-Scale Monolithic Fabrication of III–V Vertical Nanowires on a Standard Si(100) Microelectronic Substrate

[Image: see text] Vertical III–V nanowires are of great interest for a large number of applications, but their integration still suffers from manufacturing difficulties of these one-dimensional nanostructures on the standard Si(100) microelectronic platform at a large scale. Here, a top-down approac...

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Autores principales: Lecestre, Aurélie, Martin, Mickael, Cristiano, Filadelfo, Baron, Thierry, Larrieu, Guilhem
Formato: Online Artículo Texto
Lenguaje:English
Publicado: American Chemical Society 2022
Acceso en línea:https://www.ncbi.nlm.nih.gov/pmc/articles/PMC8867577/
https://www.ncbi.nlm.nih.gov/pubmed/35224344
http://dx.doi.org/10.1021/acsomega.1c05876
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author Lecestre, Aurélie
Martin, Mickael
Cristiano, Filadelfo
Baron, Thierry
Larrieu, Guilhem
author_facet Lecestre, Aurélie
Martin, Mickael
Cristiano, Filadelfo
Baron, Thierry
Larrieu, Guilhem
author_sort Lecestre, Aurélie
collection PubMed
description [Image: see text] Vertical III–V nanowires are of great interest for a large number of applications, but their integration still suffers from manufacturing difficulties of these one-dimensional nanostructures on the standard Si(100) microelectronic platform at a large scale. Here, a top-down approach based on the structure of a thin III–V epitaxial layer on Si was proposed to obtain monolithic GaAs or GaSb nanowires as well as GaAs–Si nanowires with an axial heterostructure. Based on a few complementary metal–oxide–semiconductor-compatible fabrication steps, III–V nanowires with a high crystalline quality as well as a uniform diameter (30 nm), morphology, positioning, and orientation were fabricated. In addition, the patterning control of nanowires at the nanoscale was thoroughly characterized by structural and chemical analyses to finely tune the key process parameters. To properly control the morphology of the nanowires during reactive-ion etching (RIE), the balance between the plasma properties and the formation of a protective layer on the nanowire sidewall was studied in detail. Furthermore, high-resolution microscopy analyses were performed to gain a better understanding of the protective layer’s composition and to observe the crystalline quality of the nanowires. This approach paves the way for the possible scale-up integration of III–V-based nanowire devices with conventional Si/complementary metal–oxide–semiconductor technology.
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spelling pubmed-88675772022-02-25 Large-Scale Monolithic Fabrication of III–V Vertical Nanowires on a Standard Si(100) Microelectronic Substrate Lecestre, Aurélie Martin, Mickael Cristiano, Filadelfo Baron, Thierry Larrieu, Guilhem ACS Omega [Image: see text] Vertical III–V nanowires are of great interest for a large number of applications, but their integration still suffers from manufacturing difficulties of these one-dimensional nanostructures on the standard Si(100) microelectronic platform at a large scale. Here, a top-down approach based on the structure of a thin III–V epitaxial layer on Si was proposed to obtain monolithic GaAs or GaSb nanowires as well as GaAs–Si nanowires with an axial heterostructure. Based on a few complementary metal–oxide–semiconductor-compatible fabrication steps, III–V nanowires with a high crystalline quality as well as a uniform diameter (30 nm), morphology, positioning, and orientation were fabricated. In addition, the patterning control of nanowires at the nanoscale was thoroughly characterized by structural and chemical analyses to finely tune the key process parameters. To properly control the morphology of the nanowires during reactive-ion etching (RIE), the balance between the plasma properties and the formation of a protective layer on the nanowire sidewall was studied in detail. Furthermore, high-resolution microscopy analyses were performed to gain a better understanding of the protective layer’s composition and to observe the crystalline quality of the nanowires. This approach paves the way for the possible scale-up integration of III–V-based nanowire devices with conventional Si/complementary metal–oxide–semiconductor technology. American Chemical Society 2022-02-08 /pmc/articles/PMC8867577/ /pubmed/35224344 http://dx.doi.org/10.1021/acsomega.1c05876 Text en © 2022 The Authors. Published by American Chemical Society https://creativecommons.org/licenses/by-nc-nd/4.0/Permits non-commercial access and re-use, provided that author attribution and integrity are maintained; but does not permit creation of adaptations or other derivative works (https://creativecommons.org/licenses/by-nc-nd/4.0/).
spellingShingle Lecestre, Aurélie
Martin, Mickael
Cristiano, Filadelfo
Baron, Thierry
Larrieu, Guilhem
Large-Scale Monolithic Fabrication of III–V Vertical Nanowires on a Standard Si(100) Microelectronic Substrate
title Large-Scale Monolithic Fabrication of III–V Vertical Nanowires on a Standard Si(100) Microelectronic Substrate
title_full Large-Scale Monolithic Fabrication of III–V Vertical Nanowires on a Standard Si(100) Microelectronic Substrate
title_fullStr Large-Scale Monolithic Fabrication of III–V Vertical Nanowires on a Standard Si(100) Microelectronic Substrate
title_full_unstemmed Large-Scale Monolithic Fabrication of III–V Vertical Nanowires on a Standard Si(100) Microelectronic Substrate
title_short Large-Scale Monolithic Fabrication of III–V Vertical Nanowires on a Standard Si(100) Microelectronic Substrate
title_sort large-scale monolithic fabrication of iii–v vertical nanowires on a standard si(100) microelectronic substrate
url https://www.ncbi.nlm.nih.gov/pmc/articles/PMC8867577/
https://www.ncbi.nlm.nih.gov/pubmed/35224344
http://dx.doi.org/10.1021/acsomega.1c05876
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