Development of Ag–In Alloy Pastes by Mechanical Alloying for Die Attachment of High-Power Semiconductor Devices

Sintered silver paste is widely used as the die-attachment material for power semiconductors. However, sintered silver joints encounter problems, such as severe coarsening of sintered pores and oxidation issues, in harsh high-temperature environments. These lead to the deterioration of the die-attac...

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Detalles Bibliográficos
Autores principales: Tsai, Chin-Hao, Huang, Wei-Chen, Kao, Chengheng Robert
Formato: Online Artículo Texto
Lenguaje:English
Publicado: MDPI 2022
Materias:
Article
Acceso en línea:https://www.ncbi.nlm.nih.gov/pmc/articles/PMC8874830/
https://www.ncbi.nlm.nih.gov/pubmed/35207937
http://dx.doi.org/10.3390/ma15041397

Internet

https://www.ncbi.nlm.nih.gov/pmc/articles/PMC8874830/
https://www.ncbi.nlm.nih.gov/pubmed/35207937
http://dx.doi.org/10.3390/ma15041397

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